Optical Characterization of Three-dimensional Light-emitting LED

ZOU Jun; LI Yang; ZHU Wei; CHEN Hao; QU Shi-wei; WANG Yi-ran; WU Xiao-feng; LIN Yu-jie

doi:10.3788/fgxb20153606.0657

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Optical Characterization of Three-dimensional Light-emitting LED

更新时间：2020-08-12

- Optical Characterization of Three-dimensional Light-emitting LED
- Chinese Journal of Luminescence Vol. 36, Issue 6, Pages: 657-660(2015)
- 作者机构：
  
  1. 上海应用技术学院理学院上海,201418
  2. 上海应用技术学院材料与工程学院上海,201418
  3. 浙江亿米光电科技有限公司,浙江嘉兴,314100
  4. 上海博恩世通光电股份有限公司上海,201108
- 作者简介：
- 基金信息：
- DOI：10.3788/fgxb20153606.0657
  CLC： TN383+.1;O482.31
- Received：20 January 2015，
  
  Revised：09 April 2015，
  
  Published：03 June 2015
- 稿件说明：
移动端阅览
邹军, 李杨, 朱伟等. 立体发光LED灯片的光学性能研究[J]. 发光学报, 2015,36(6): 657-660

ZOU Jun, LI Yang, ZHU Wei etc. Optical Characterization of Three-dimensional Light-emitting LED[J]. Chinese Journal of Luminescence, 2015,36(6): 657-660
邹军, 李杨, 朱伟等. 立体发光LED灯片的光学性能研究[J]. 发光学报, 2015,36(6): 657-660 DOI： 10.3788/fgxb20153606.0657.

ZOU Jun, LI Yang, ZHU Wei etc. Optical Characterization of Three-dimensional Light-emitting LED[J]. Chinese Journal of Luminescence, 2015,36(6): 657-660 DOI： 10.3788/fgxb20153606.0657.

摘要

立体发光灯片的关键是在保证光通量的前提下

如何获得均匀的正反面发光。本文对3种荧光粉平面涂覆立体灯片的正面和反面的瞬态和稳态光通量、色温、色品坐标进行了研究

发现直接涂覆荧光粉胶的灯片总的光通量最大

但正反面的发光性能相差很大;在涂覆荧光粉之前先平面涂覆一层硅胶

可获得正反面发光较均匀的灯片;而在该硅胶层内掺杂扩散粉的灯片

不但没有提高灯片的正反面发光均匀度

反而大幅度降低了光通量值。此外

测试3种样品的发光角度

发现其发光角度分布相似

而发光强度与积分球测试的光通量比值相近。结果表明

涂覆荧光粉之前先平面涂覆一层硅胶工艺

既可以保证立体发光灯片具有较大的光通量又可以获得均匀的正反面发光。

Abstract

The luminescence performance characterized by luminous flux

color temperature

chromaticity coordinate of three-dimensional light emitting diodes (LEDs) has been investigated by using different phosphor coating methods. The LED die was directly coating with mixed phosphors and silicone which have the maximum total luminous flux. However

this encapsulation incurs luminous uneven problem of front and back which limit three-dimensional luminescence application. Therefore

this work attempts to use the silicon and spreading powder to change the light path on the basis of less loss of luminous flux. Experimental results indicate that the brightness uniformity can be improved when increasing silicon layer between LED die and phosphor

while spreading powder layer would induce significant light attenuation. Moreover

the three packing have similar light angle. Therefore

silicon layer provides an alternative packing solution for three-dimensional LED light application.

关键词

Keywords

references

Chang M H, Das D, Varde P V, et al. Light emitting diodes reliability review [J]. Microelectron. Reliab., 2012, 52(5):762-782.

Wang C P, Chen T T, Fu H K, et al. Analysis of thermal characteristics and mechanism of degradation of flip-chip high power LEDs [J]. Microelectron. Reliab., 2014, 52(4):698-703.

Zhong G M, Du X Q, Tian J. Simulation and analysis of light extraction efficiency of GaN-based flip-chip light-emitting diodes [J]. Chin. J. Lumin.(发光学报), 2011, 32(8):773-778 (in Chinese).

Kim H, Lee S N, Cho J. Electrical and optical characterization of GaN-based light-emitting diodes fabricated with top-emission and flip-chip structures [J]. Mater. Sci. Semicond. Proc., 2010, 13(3):180-184.

Liu Y, Leung Stanley Y Y, Zhao J, et al. Thermal and mechanical effects of voids within flip chip soldering in LED packages [J]. Microelectron. Reliab., 2014, 54(9-10):2028-2033.

Li L, Fang Y Z, Zou J, et al. Non-polar ZnO thin films and LED devices [J]. Adv. Mater. Res., 2014, 1053:373-380.

Li Y, Dong S S, Wang Y R, et al. Optical characterization of light-emitting diodes fabricated with vertical and flip-chip structure [J]. Electro-Opt. Technol. Appl.(光电技术应用), 2014, 29(5):47-51 (in Chinese).

Qian K Y, Zheng D S, Luo Y. Thermal dispersion of GaN-based power LEDs [J]. Semicond. Optoelectron.(半导体光电), 2006, 27(3):236-239 (in Chinese).

Ma X J, Wu L G, Dai S X, et al. Thermal analysis of high-power LED downlight [J]. China Illumin. Eng. J.(照明工程学报), 2011, 22(6):18-21 (in Chinese).

Li A Y, Zhu W Z. Key factors in cooling of high-power LED packages [J]. J. Xiamen Univ. Technol.(厦门理工学院学报), 2011, 19(4):10-13 (in Chinese).

Wang Y R, Li Y F, Zou J, et al. White LED accelerated aging performance analysis [J]. China Light & Lighting (中国照明电器), 2014(10):43-46 (in Chinese).

Zhang S D, Wang F C, Zou J. Influence research on LED encapsulation light source from YAG phosphor with different particle size [J]. Electro-Opt. Technol. Appl.(光电技术应用), 2014, 29(4):21-23 (in Chinese).

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旭宇光电(深圳)股份有限公司

深圳清华大学研究院

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