ZHANG Xu, ZHANG Jie, YAN Zhao-wen etc. XPS Test Analysis of Ohmic Contact Layer of Photodetector[J]. Chinese Journal of Luminescence, 2014,35(12): 1459-1463
ZHANG Xu, ZHANG Jie, YAN Zhao-wen etc. XPS Test Analysis of Ohmic Contact Layer of Photodetector[J]. Chinese Journal of Luminescence, 2014,35(12): 1459-1463 DOI: 10.3788/fgxb20143512.1459.
XPS Test Analysis of Ohmic Contact Layer of Photodetector
Low Ohmic contact layers with the specific contact resistance of 4.510
-5
cm
2
were fabricated on the organic layer surface of PTCDA/P-Si photodetector chip. The electronic states of the interface of Al/Ni/ITO structure Ohmic contact layer were investigated using X-ray photoelectron spectroscopy (XPS). In ITO
In
3d
and Sn
3d
arise two peaks of split level
respectively. They are the binding energy of In and Sn atom located in oxidizing environment. Ni
2p
has two spectra peaks of Ni
2p(1)
and Ni
2p(2)
. The lower binding energy location is Ni
2p(1)
which is excited by X-ray. It indicates that no chemical reaction happens between Ni and ITO layer
and the formation of A1
2
O
3
has been prevented. As for Ni
2p(2)
peak
it indicates that Al
3
Ni alloy phase has formed
which is good for the formation of low resistance Ohmic contact layer.
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references
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