ZHOU Chi, ZUO Dun-wen, SUN Yu-li. Experimental Investigation of Integrated Heat Pipe Heat Sink for Multi-chip LED Module in Natural Convection[J]. Chinese Journal of Luminescence, 2014,35(11): 1394-1400
ZHOU Chi, ZUO Dun-wen, SUN Yu-li. Experimental Investigation of Integrated Heat Pipe Heat Sink for Multi-chip LED Module in Natural Convection[J]. Chinese Journal of Luminescence, 2014,35(11): 1394-1400 DOI: 10.3788/fgxb20143511.1394.
Experimental Investigation of Integrated Heat Pipe Heat Sink for Multi-chip LED Module in Natural Convection
In order to solve the problem of cooling LED multi-chip LED module
an integrated heat pipe heat sink was designed and fabricated. Heat dissipation experiments were conducted to study effects on heat load
filling ratio and inclination angle on the thermal performance of the heat sink in nature convection. The results show that the efficient heat transfer of the heat pipe can reduce the thermal resistance of the heat sink effectively and the optimum filling ratio is 30% in this research. Inclination angle in the range of 0-50 has little effect on heat transfer capability of heat pipe at lower heat load. When the angle reaches 75
heat transfer of heat pipe and thermal resistance of heat sink are all subject to a significant deterioration. The time heat sink enters stable state is about 30 min and is not affected by the magnitude of the power. However
the heat sink works stably after 40 min when angle is 75. Compared to traditional parallel plate fins and sunflower fins heat sink
the chip junction temperature with integrated heat pipe heat sink is smallest.
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references
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