Thermal Analysis and Thermal Design of Organic Light-emitting Diode

YANG Lian-qiao; FU Mei-juan; WEI Bin; ZHANG Jian-hua; CAO Jin

doi:10.3788/fgxb20123306.0624

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Thermal Analysis and Thermal Design of Organic Light-emitting Diode

Device Fabrication & Physics | 更新时间：2020-08-12

- Thermal Analysis and Thermal Design of Organic Light-emitting Diode
- Chinese Journal of Luminescence Vol. 33, Issue 6, Pages: 624-627(2012)
- 作者机构：
  
  上海大学新型显示及集成应用教育部重点实验室上海,200072
- 作者简介：
- 基金信息：
- DOI：10.3788/fgxb20123306.0624
  CLC： TN305.94;TN364+.2
- Received：23 February 2012，
  
  Revised：2012-4-11，
  
  Published Online：10 June 2012，
  
  Published：10 June 2012
- 稿件说明：
移动端阅览
杨连乔, 付美娟, 魏斌, 张建华, 曹进. 有机发光二极管的热分析与热设计[J]. 发光学报, 2012,(6): 624-627

YANG Lian-qiao, FU Mei-juan, WEI Bin, ZHANG Jian-hua, CAO Jin. Thermal Analysis and Thermal Design of Organic Light-emitting Diode[J]. Chinese Journal of Luminescence, 2012,(6): 624-627
杨连乔, 付美娟, 魏斌, 张建华, 曹进. 有机发光二极管的热分析与热设计[J]. 发光学报, 2012,(6): 624-627 DOI： 10.3788/fgxb20123306.0624.

YANG Lian-qiao, FU Mei-juan, WEI Bin, ZHANG Jian-hua, CAO Jin. Thermal Analysis and Thermal Design of Organic Light-emitting Diode[J]. Chinese Journal of Luminescence, 2012,(6): 624-627 DOI： 10.3788/fgxb20123306.0624.

摘要

采用基于计算流体动力学的热学模拟仿真与瞬态热学测试技术分析了OLED的热学特性

研究并讨论了输入功率、面板取向、风速等实际应用变量对OLED面板结温的影响。研究结果表明

OLED的结温与衬底及封装盖表面存在明显的温度梯度

且此温度梯度随输入电流增加大幅增大。OLED的热学特性与面板取向、气流速度密切相关。

Abstract

Computational fluid dynamic (CFD) based thermal simulation and transient thermal measurement are utilized to evaluate the thermal performance of OLED in this paper. The effects of input power

panel orientation and air velocity on the thermal characteristics of OLED are investigated and discussed. It is found that obvious thermal gradient exists between junction and substrate or glass cover

and the thermal gradient increases obviously with the input power. The thermal characteristic has a close relationship with the orientation of OLED panel and air velocity.

关键词

Keywords

references

Sun Sanchun, Fukuda Takeshi, Cao Jin, et al. High luminance microcavity organic light-emitting diodes [J]. J. Optoelectronics Laser (光电子·激光), 2009, 20(5):609-611 (in Chinese).

Cui Guoyu, Li Chuannan, Li Tao, et al. Organic light-emitting device with Li3N n-type doped electron injecting layer [J]. Acta Photonica Sinica (光子学报), 2011, 40(2):194-198 (in Chinese).

Zhao Yongbiao, Chen Jiangshan, Ma Dongge. Realization of high efficiency orange and white organic light emitting diodes by introducing an ultra-thin undoped orange emitting layer [J]. Appl. Phys. Lett., 2011, 99(16):163303-1-3.

Ni Weide, Wu Youzhi, Zhang Wenlin, et al. Highly efficient nondoped blue organic light-emitting diode using MoO3 as anode buffer layer [J]. Chin. J. Lumin.(发光学报), 2011, 32(12):1272-1275 (in Chinese).

Zhu Jianzhuo, Li Wenlian. Double-host high efficiency white organic light-emitting diodes with high color rendering index [J]. Chin. J. Lumin.(发光学报), 2012, 33(3):299-303 (in Chinese).

Song Chunli, Xu Yang, Zhou Hefeng, et al. Synthesis and properties of a novel type of red-light organic electroluminescence material [J]. Chin. J. Lumin.(发光学报), 2011, 32(3):285-289 (in Chinese).

Vamvounis G, Aziz H, Hu N X, et al. Temperature dependence of operational stability of organic light emitting diodes based on mixed emitter layers [J]. Synthetic Metals, 2004, 143(1):69-73.

Tsuji H, Oda A, Kido J, et al. Temperature measurements of organic light-emitting diodes by Stokes and anti-Stokes Raman scattering [J]. Jpn. J. Appl. Phys., 2008, 47(4):2171-2173.

Cheung S, Lee J H, Jeong J, et al. Substrate thermal conductivity effect on heat dissipation and lifetime improvement of organic light-emitting diodes [J]. Appl. Phys. Lett., 2009, 94(25):253302-1-3.

Gielen A W J, Barink M, van den Brand J, et al. The electro-thermal-mechanical performance of an OLED:A multi-physics model study //Proceeding of the 10th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, Delft, Netherlands:IEEE, 2009:1-6.

Kim L, Shin M W. Thermal resistance measurement of LED package with multichips [J]. IEEE Trans. Compon. Packag. Technol., 2007, 30(4):632-636.

Lin Y, Lu Y J, Gao Y L, et al. Measuring the thermal resistance of LED packages in practical circumstances [J]. Thermochimica Acta, 2011, 520(1-2):105-109.

van der Tempel L, Melis G P, Brandsma T C. Thermal conductivity of a glass:I. Measurement by the glass-metal contact [J]. Glass Phys. Chem., 2000, 26(6):606-611.

Wang W J, Lee T H, Choi J H, et al. Thermal investigation of GaN-based laser diode package [J]. IEEE Trans. Compon. Packag. Technol., 2007, 30(4):637-642.

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