Thermal Simulation for Design of LED COB Package

LAN Hai; DENG Zhong-hua; LIU Zhu-guang; HUANG Ji-quan; CAO Yong-ge

doi:10.3788/fgxb20123305.0535

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Thermal Simulation for Design of LED COB Package

paper | 更新时间：2020-08-12

- Thermal Simulation for Design of LED COB Package
- Chinese Journal of Luminescence Vol. 33, Issue 5, Pages: 535-539(2012)
- 作者机构：
  
  1. 中国科学院福建物质结构研究所,福建福州,350002
  2. 中国科学院研究生院北京,100039
- 作者简介：
- 基金信息：
- DOI：10.3788/fgxb20123305.0535
  CLC： TN312.8
- Received：29 February 2012，
  
  Revised：08 April 2012，
  
  Published Online：10 May 2012，
  
  Published：10 May 2012
- 稿件说明：
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兰海, 邓种华, 刘著光, 黄集权, 曹永革. LED的COB封装热仿真设计[J]. 发光学报, 2012,(5): 535-539

LAN Hai, DENG Zhong-hua, LIU Zhu-guang, HUANG Ji-quan, CAO Yong-ge. Thermal Simulation for Design of LED COB Package[J]. Chinese Journal of Luminescence, 2012,(5): 535-539
兰海, 邓种华, 刘著光, 黄集权, 曹永革. LED的COB封装热仿真设计[J]. 发光学报, 2012,(5): 535-539 DOI： 10.3788/fgxb20123305.0535.

LAN Hai, DENG Zhong-hua, LIU Zhu-guang, HUANG Ji-quan, CAO Yong-ge. Thermal Simulation for Design of LED COB Package[J]. Chinese Journal of Luminescence, 2012,(5): 535-539 DOI： 10.3788/fgxb20123305.0535.

摘要

通过对COB封装中常用的陶瓷基板和金属基板这两类不同的基板材料进行有限元热仿真模拟

获得各自芯片到基板的仿真热阻

再使用红外热成像仪得到两种基板各自的表面温度分布情况并计算出实际热阻。仿真热阻与实际热阻的一致性表明了所采用的仿真计算方法的可用性。利用有限元仿真对COB封装的热管理方案进行了优化分析。研究表明:相对于金属基板

陶瓷基板由于无绝缘层这一散热瓶颈

其芯片到基板的热阻值约为金属基板封装方案的1/2;而且陶瓷基板有着更大的热管理优化空间

能更好地满足大功率LED封装的散热需要。

Abstract

Two typical types of substrate materials

i.e.

ceramic substrates without insulating layer and metal substrate with insulating layer were studied for the thermal management of COB package. Their chip-to-substrate thermal resistances were simulated and calculated by finite element method. Temperature distribution in two substrates was obtained by infrared thermography

which confirmed the adopted finite element method is feasible in our experiment. Based on these studies

the thermal management of COB package was optimized by finite element simulation. The results show that the ceramic substrate has a lower chip-to-substrate thermal resistance (only half of that of the metal substrate)

which indicate that it is more suitable for the heat dissipation in high-power LED package.

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Keywords

references

Chen Ting, Chen Zhizhong, Lin Liang, et al. Methods for determining junction temperature of GaN-based white LEDs [J]. Chin. J. Lumin.(发光学报), 2006, 27(3):407-412 (in Chinese).[2] Jiang Bin, Song Guohua, Miao Jianwen, et al. Thermal analysis of high-power LED based on COB packaging technology [J]. Electronic Components and Materials (电子元件与材料), 2011, 30(6):48-52 (in Chinese).[3] Dai Weifeng, Wang Jun, Li Yuesheng. Transient thermal analysis of high-power LED package [J]. Semiconductor Opto-electronics (光电器件), 2008, 29(3):324-328 (in Chinese).[4] Ma Hongxia, Qian Keyuan, Han Yanjun, et al. Thermal design of GaN-based high-power LED module [J]. Semiconductor Optoelectronics (光电器件), 2007, 28(5):627-630 (in Chinese).[5] Wang Wei, Wang Wanliang, Pan Jiangen, et al. Study and analysis of test system for thermal characteristic of high power LED [J]. Chinese Journal of Liquid Crystals and Displays (液晶与显示), 2009, 24(2):294-298 (in Chinese).[6] Kim L, Choi J H, Jang S H, et al. Thermal analysis of LED array system with heat pipe [J]. Thermochim. Acta, 2007, 455(1-2):21-25.[7] Ma Xiangzhu, Huo Jin, Qu Yi, et al. Thermal-resistor analysis of the laser chips with different size in C-mount package [J]. Chin. J. Lumin.(发光学报), 2011, 32(2):184-187 (in Chinese).

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