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Improvement of Heat Dissipation Performance of Deep Ultraviolet LED
Device Fabrication and Physics | 更新时间：2024-10-31
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    • Improvement of Heat Dissipation Performance of Deep Ultraviolet LED

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    • “The latest research reveals that optimizing the size of DUV-LED chips and filling gaps in solder layers can significantly reduce thermal resistance and improve heat dissipation performance.”
    • Chinese Journal of Luminescence   Vol. 45, Issue 10, Pages: 1707-1715(2024)

    • DOI：10.37188/CJL.20240173    

      CLC： TN312.8

    • Published：26 October 2024，

      Received：18 July 2024，

      Revised：01 August 2024，

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  • ZHAO JIANGUO, YANG JIANAN, XU RU, et al. Improvement of Heat Dissipation Performance of Deep Ultraviolet LED. [J]. Chinese journal of luminescence, 2024, 45(10): 1707-1715. DOI： 10.37188/CJL.20240173.

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