您当前的位置：
首页 >
文章列表页 >
Improvement of Heat Dissipation Performance of Deep Ultraviolet LED
Device Fabrication and Physics | 更新时间：2024-10-31
|

    • Improvement of Heat Dissipation Performance of Deep Ultraviolet LED

      增强出版
    • “The latest research reveals that optimizing the size of DUV-LED chips and filling gaps in solder layers can significantly reduce thermal resistance and improve heat dissipation performance.”
    • Chinese Journal of Luminescence   Vol. 45, Issue 10, Pages: 1707-1715(2024)

    • DOI：10.37188/CJL.20240173    

      CLC： TN312.8

    • Received：18 July 2024，

      Revised：01 August 2024，

      Published：26 October 2024

    移动端阅览

  • ZHAO Jianguo,YANG Jianan,XU Ru,et al.Improvement of Heat Dissipation Performance of Deep Ultraviolet LED[J].Chinese Journal of Luminescence,2024,45(10):1707-1715. DOI： 10.37188/CJL.20240173.

  •  
  •  

0

Views

226

下载量

0

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

Thermal Characteristics Analysis of C-mount Sink Package Laser and Optimization of Heat Sink Structure
Experimental Investigation of Integrated Heat Pipe Heat Sink for Multi-chip LED Module in Natural Convection
Thermal Analysis and Thermal Design of Organic Light-emitting Diode
Junction Temperature and Thermal Resistance Restrict the Developing of High-power LED

Related Author

CHANG Jiahua
ZHANG Xiao-lei
BO Bao-xue
ZHANG Zhe-ming
GU Hua-xin
LIU Li-ning
XU Yu-meng
QIAO Zhong-liang

Related Institution

State Key Laboratory of High Power Semiconductor Laser, Changchun University of Science and Technology, Changchun 130022, China
College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics
Key Laboratory of Advanced Display and System Applications (Shanghai University), Ministry of Education, Shanghai University
Foshan NationStar Optoeletronics Co. Ltd. Foshan 528000 China
Jlight Semiconductor Technology Co.，Ltd.
0