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Influence of Copper Substrate Area, Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs
Luminescence Industry and Technology Frontier | 更新时间：2024-08-06
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    • Influence of Copper Substrate Area, Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs

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    • “In the field of semiconductor lighting technology, the latest research has revealed the significant impact of copper substrate area, solder thickness, and conductive copper foil thickness on the ultimate optoelectronic performance of high-power LED devices. The experimental results show that by optimizing these parameters, the maximum light intensity and operating voltage of LEDs can be significantly improved, providing important guidance for the application of high-power LED devices.”
    • Chinese Journal of Luminescence   Vol. 45, Issue 7, Pages: 1196-1210(2024)

    • DOI：10.37188/CJL.20240090    

      CLC： TN304

    • Received：01 April 2024，

      Revised：22 April 2024，

      Published：25 July 2024

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  • HUANG Linfeng,XIONG Chuanbing,TANG Yingwen,et al.Influence of Copper Substrate Area, Solder and Copper Foil Thickness on Maximum Output Light Intensity and Voltage of High Power Density LEDs[J].Chinese Journal of Luminescence,2024,45(07):1196-1210. DOI： 10.37188/CJL.20240090.

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