Effect of trimethyl–aluminum preflow on the structure and strain properties of AlN films

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Effect of trimethyl–aluminum preflow on the structure and strain properties of AlN films

paper | 更新时间：2020-08-12

- Effect of trimethyl–aluminum preflow on the structure and strain properties of AlN films
- Chinese Journal of Luminescence Vol. 32, Issue 4, (2011)
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  CLC： 047
- Received：07 September 2011，
  
  Revised：10 October 2011，
  
  Published Online：12 October 2011，
  
  Published：12 October 2011
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贾辉孙晓娟蒋红李志明缪国庆黎大兵宋航陈一仁. 预通三甲基铝(TMAl)对AlN薄膜的结构与应变的影响[J]. 发光学报, 2011,32(4): 0-0

. Effect of trimethyl–aluminum preflow on the structure and strain properties of AlN films[J]. Chinese Journal of Luminescence, 2011,32(4): 0-0
贾辉孙晓娟蒋红李志明缪国庆黎大兵宋航陈一仁. 预通三甲基铝(TMAl)对AlN薄膜的结构与应变的影响[J]. 发光学报, 2011,32(4): 0-0 DOI：

. Effect of trimethyl–aluminum preflow on the structure and strain properties of AlN films[J]. Chinese Journal of Luminescence, 2011,32(4): 0-0 DOI：

摘要

采用有机金属化学气相沉积用两步生长法在(0001)蓝宝石衬底上AlN薄膜。研究了预通三甲基铝(TMAl)使衬底铝化对外延AlN的影响。利用高分辨X射线衍射技术(XRD)和扫描电子显微镜(SEM) 分析了样品的结晶质量以及外延膜中的残余应力. 通过SEM观察发现短时间的预通TMAl处理对AlN薄膜表面的影响不大；但随着预通时间的增加，表面会出现六角形的岛。其原因由于通过优化TMAl的预通时间可以保护衬底被氮化有利于Al极性面AlN的生长，从而得到的Al极性面AlN表面比较平整；但是随着预通TMAl时间过长会使衬底表面沉积金属态铝而不容易形成平整的表面。X射线双晶摇摆曲线结果表明：样品的(0002)和(10-12)面的X射线双晶摇摆曲线的半峰宽随着预通TMAl时间的不断增加，由此得出薄膜的晶体质量不断下降。这可以解释为：预通TMAl使形成的晶核不再规则，从而在成核层形成了很多亚颗粒降低了晶体质量。进一步对XRD结果分析，我们也发现了这样的应力变化。这种应力的变化的起源可以归结于内应力（岛的合并在其晶界引入的应力）与外应力（晶格失配与热失配引起的应力）共同作用的结果。

Abstract

We studied the effects of trimethylaluminum (TMAl) preflow on the properties of AlN films grown on (0001) sapphire substrates via metalorganic chemical vapor deposition using high-temperature treatments. Short TMAl preflow treatments had little effect on the surface morphology of the AlN films

but hexagonal islands appeared on the surface when the TMAl preflow time was increased. As the preflow time increased

the crystalline quality decreased and the stress state of the AlN films also changed. The origin of this stress behavior can be explained through a combination of extrinsic stress and intrinsic stress.

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references

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