Heat Dissipation Analysis of High Power LED Connected to Copper Coated Heat Sink by Soldering

CHAI Wei-wei; CHEN Qing-hua; LI Ling-hong; TANG Wen-yong; ZHANG Xue-qing; HE Zhi-qiang

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Heat Dissipation Analysis of High Power LED Connected to Copper Coated Heat Sink by Soldering

paper | 更新时间：2020-08-12

- Heat Dissipation Analysis of High Power LED Connected to Copper Coated Heat Sink by Soldering
- Chinese Journal of Luminescence Vol. 32, Issue 11, Pages: 1171-1175(2011)
- 作者机构：
  
  重庆大学动力工程学院重庆,400030
- 作者简介：
- 基金信息：
- DOI：
  CLC： TK172.4;TN312+.8
- Received：29 June 2011，
  
  Revised：26 July 2011，
  
  Published Online：22 November 2011，
  
  Published：22 November 2011
- 稿件说明：
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柴伟伟, 陈清华, 李琳红, 唐文勇, 张学清, 贺志强. 大功率LED灯珠与散热器直焊结构散热效果分析[J]. 发光学报, 2011,32(11): 1171-1175

CHAI Wei-wei, CHEN Qing-hua, LI Ling-hong, TANG Wen-yong, ZHANG Xue-qing, HE Zhi-qiang. Heat Dissipation Analysis of High Power LED Connected to Copper Coated Heat Sink by Soldering[J]. Chinese Journal of Luminescence, 2011,32(11): 1171-1175
柴伟伟, 陈清华, 李琳红, 唐文勇, 张学清, 贺志强. 大功率LED灯珠与散热器直焊结构散热效果分析[J]. 发光学报, 2011,32(11): 1171-1175 DOI：

CHAI Wei-wei, CHEN Qing-hua, LI Ling-hong, TANG Wen-yong, ZHANG Xue-qing, HE Zhi-qiang. Heat Dissipation Analysis of High Power LED Connected to Copper Coated Heat Sink by Soldering[J]. Chinese Journal of Luminescence, 2011,32(11): 1171-1175 DOI：

摘要

散热是制约大功率LED发展的瓶颈

为了更好地解决散热问题

采用新型冷喷涂技术

在铝合金散热器表面喷涂铜层

实现了LED灯珠与散热器的直焊

取代了目前使用导热硅胶等热界面材料压接的方式

有效地消除了压接产生的接触热阻

显著改善了散热效果。通过建立LED灯具的三维模型

采用CAE软件模拟和实验两种方法验证了LED灯具直焊结构的散热效果明显优于压接结构

并且随着LED输入功率的增大

直焊结构的散热优势更加显著。

Abstract

Heat dissipation of high-power LED is the main bottleneck for its application. In order to better solve the heat dissipation problem

a new cold spray technology is applied to deposit thin copper coating which can make the soldering of LED head with heat sink possible

and this can significantly extend the durability of high-power LED lamp when comparing with current high-power LED lamp using crimped connection with thermal interface material

also can decrease the thermal contact resistance. Better heat dissipation performance of high-power LED has been verified by CAE software simulation and experiments. And with the increase of input power for LED lamps

the temperature difference of the LED chip between soldering and crimping structure also increases

the cooling effect of soldering is more significant. However

at present the thermal conductivity of the copper layer by cold spray is only 160 W/(mK)

which has a great gap with the conventional copper's thermal conductivity 398 W/(mK)

so the cold spray process needs to be further improved.

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Keywords

references

Lei Yong, Fan Guanghua, Liao Changjun, et al. Research on the thermal property of powerful white LEDs [J]. J. Opto-electronicsLaser (光电子激光), 2006, 17 (8):945-947 (in Chinese).[2] Lin Y C, Nguyen T, Zhou Y, et al. Materials challenges and solutions for the packaging of high power LEDs //International Microsystems, Packing, Assembly Conference ,Taiwan, China: IEEE, 2006:177-180.[3] Su Da, Wang Demiao. Technical research on heat- release package of high-power LEDs [J]. China Illuminating Enginee-ring Journal, 2007, 18 (2):69-71,55.[4] Li Geng, Zhou Yong, Xue Sa, et al. Cold spray technology [J]. Heat Treatment Technology and Equipment(热处理技术与装备), 2009, 30 (4):11-14 (in Chinese).[5] Wang Le, Wu Ke, Yu Yibo, et al. Study on LED array heat transfer under natural convection based on CFD [J]. J. OptoelectronicsLaser (光电子激光), 2010, 21 (12):1758-1762 (in Chinese).

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Related Institution

School of Mechanical Science and Engineering， Huazhong University of Science and Technology

School of Aerospace Engineering， Huazhong University of Science and Technology

State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences

College of Materials Science and Engineering, Fuzhou University

Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Science

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