The Designing and Driving Technology of the Illumination Board of the High Power Bright White LED Street Lamp

BAI Lin; LIANG Hong-bao

doi:null

您当前的位置：

首页 >

文章列表页 >

The Designing and Driving Technology of the Illumination Board of the High Power Bright White LED Street Lamp

paper | 更新时间：2020-08-12

- The Designing and Driving Technology of the Illumination Board of the High Power Bright White LED Street Lamp
- Chinese Journal of Luminescence Vol. 30, Issue 4, Pages: 487-494(2009)
- 作者机构：
  
  1. 中国石油大庆石化公司炼油厂,黑龙江大庆,163711
  2. 大庆石油学院计算机与信息技术学院, 黑龙江大庆 163318
  3. 大庆石油学院现代教育中心, 黑龙江大庆 163318
- 作者简介：
- 基金信息：
- DOI：
  CLC： TN312.8
- Received：17 September 2008，
  
  Revised：02 January 1900，
  
  Published Online：30 August 2009，
  
  Published：30 August 2009
- 稿件说明：
移动端阅览
BAI Lin, LIANG Hong-bao. The Designing and Driving Technology of the Illumination Board of the High Power Bright White LED Street Lamp[J]. Chinese journal of luminescence, 2009, 30(4): 487-494.
DOI：

BAI Lin, LIANG Hong-bao. The Designing and Driving Technology of the Illumination Board of the High Power Bright White LED Street Lamp[J]. Chinese journal of luminescence, 2009, 30(4): 487-494. DOI：

摘要

为最大可能提高大功率LED路灯发光板的电光转化率与散热效率

在不影响外量子效率前提下对LED芯片设计采用扩大LED芯片面积

以及电极优化技术增加LED芯片的出光量

使芯片表面热流均匀分布

芯片工作更稳定。分析了大功率白光LED的封装过程对提高芯片取光率、保障白光质量、器件散热技术的综合应用。综合上述技术及有限元分析软件对大功率LED器件封装的热阻分析结果

确定了COB(chip on board)LED芯片的阵列组装技术

为制造LED路灯发光板的最佳技术方案。LED芯片结温很容易控制在120 ℃以下

与外部散热技术兼容性好。通过光线最佳归一化数学模型计算了LED芯片阵列芯片间最佳距离。最后通过对各种白光LED驱动方案的比较

确定了白光LED最佳驱动方案为恒电流驱动脉宽调制(PWM)调节亮度。

Abstract

For doing the best to improve the ratio of the transformation from electronic power to luminous energy and efficiency of heat dissipation for the luminous board of the high power bright white LED street lamp

the method to extend area of LED chip was adopted and don't decrease LED's external quantum efficiency when LED chip was designed and made. The technology of optimizing was adopted for increasing luminous quantity

and let LED chip's heat distribute on the LED chips surface averagely and make LED chip work in stable status. The integrated technology was analyzed to enhance efficiency of geting light and assure the quality of white bright emission by LED device and heat dissipation of LED device. The best technology

which was adopted to array matrix of LED chips of luminous board with high power bright white LED for street lamp

is COB (chip on board) technology

and according to the technology result

the thermal resistance of the packaging solution for high power bright white LED chip was analyzed by Finite Element Analysis Software.The technology of COB makes LED devices temperature easyly to be controlled below 120 ℃ when it is electrified

and it is easier for COB to compatible with external cooling devices. The optimum distance of the LED chips of the luminous board with high power bright white LED for street lamp was figured out by the formula to make bright to be best normalized. The best optimum driving scheme for high power white bright LED street lamp was defined

that LED street lamp must be drived by constant current and the brightness of the street lamp was regulated by the PWM technology at last.

关键词

Keywords

references

. Mueller-Mach R, Mueller G O, Krames M R, et al. High-power phosphor converted light emitting diode based on Ⅲ-nitrides [J]. IEEE Selected Topics in Quantum Electronics, 2002, 8 (2):339-345.

. Wang Erzhen. The technology of the power white lightness LED [J]. Lamp and Light Source (灯与光源), 2003, 27 (4):26-31 (in Chinese).

. Liu Xingren. Phosphors for white LED solid state lighting [J]. Chin. J. Lumin. (发光学报), 2007, 28 (3):291-301 (in Chinese).

. Wang Jian, Huang Xian, Liu Li, et al. Effect of temperature and current on LED luminous efficieency [J]. Chin. J. Lumin.(发光学报), 2008, 29 (2):358-362 (in Chinese).

. Xiao Yunguo. Effect of Current Crowding and Device Structure on Operation of Gallium Nitride Based Light Emitting Diodes . Boston: Boston University, College of Engineering, 2002.

. Pan Huapu, Hung Liwei, Li Rui, et al. Finite element model of GaN based LED and the optimization of the mesa sturcture [J]. Chin. J. Lumin. (发光学报), 2007, 28 (1):114-120 (in Chinese).

. Daniel A, Steigerwald J C, Bhat D C. Illumination with solid state lighting technology [J]. IEEE Selected Topecs in Qunatum Electronics, 2002, 8 (2):310-320.

. Ma Zetao, Zhu Daqing, Wang Xiaojun. Thermal analysis of high-power light-emitting diode packages [J]. Semiconductor Optoelectronics (半导体光电), 2006, 27 (1):16-19 (in Chinese).

. Li Huaping, Chai Guangyue, Peng Wenda, et al. Package and MCPCB for high-power LEDs [J]. Semiconductor Opto-electronics(半导体光电), 2007, 28 (1):47-50 (in Chinese).

. Moreno I. Configurations of LED arrays for uniform illumination [J]. SPIE, 2004, 56 (22):713-718.

. Ivan Moreno, Rumen I, Zonchev T. Effects on illumination uniformity due to dilution on arrays of LEDs [J]. SPIE, 2004, 55 (29):268-275.

. Chen Wei, Shen Hui, Wang Donghai, et al. Research on driving technology of semiconductor illumination light source by using solar energy [J]. China Illuminating Engineering Journal (照明工程学报), 2005, 16 (3):7-10 (in Chinese).

. Pang Yunfan. Vision and Lighting [M]. Beijing: The Railway Publisher, 1993, 3.

Views

1537

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

A Digital Dimming Color and Intensity Method of Three-channel LED

Related Author

LUO Wei-an

WANG Han

CHEN Xin-du

ZENG Yao-bin

LI Zhi-jin

HE Rui-guo

Related Institution

School of Electro-mechanical Engineering, Guangdong University of Technology

Department of Foshan Supervision Testing Center of Quality and Metrology

AI问答

Address：No.3888 Dong Nanhu Road, Changchun, Jilin, China Postal code：130033
Tel：0431-86176862 Email：fgxbt@126.com
Technical support is provided by Beijing Founder electronics co., LTD 吉ICP备11002662号-17 京公网安备11010802024621
It is recommended to read the content of this site in Chrome&IE9+. Please switch to extreme mode in browser 360.
Cookies We use cookies to help provide and enhance our service and tailor content. By continuing, you agree to the use of cookies.

⁰